Patent Assignment
Reel/Frame 031108/0196
Assignment of Assignor's Interest
Recorded: 2013-08-29
Pages: 3
Assignors
KYOZUKA, MASAHIRO
Executed: 2013-07-05
TATEIWA, AKIHIKO
Executed: 2013-07-08
KUNIMOTO, YUJI
Executed: 2013-07-05
FURUICHI, JUN
Executed: 2013-07-10
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method