IP Library › Assignment 031133/0911
Patent Assignment
Reel/Frame 031133/0911

Assignment of Assignor's Interest

Recorded: 2013-09-03 Pages: 2
Assignors
SAIDO, SHUHEI
Executed: 2013-07-29
HARA, DAISUKE
Executed: 2013-07-29
SASAKI, TAKAFUMI
Executed: 2013-07-29
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method for Manufacturing Substrate, and Method for Manufacturing Semiconductor Device
Patent: 9,082,694 →
Application: 14/001,510 →
Publication: US 2013/0330930
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →