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Patent Assignment
Reel/Frame 031197/0692

Assignment of Assignor's Interest

Recorded: 2013-09-12 Pages: 4
Assignors
OKADA, SATOSHI
Executed: 2013-08-21
TAKAGI, KOSUKE
Executed: 2013-08-21
KAGA, YUKINAO
Executed: 2013-08-21
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Reaction Tube, Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Patent: 9,263,269 →
Application: 14/025,710 →
Publication: US 2014/0073146
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →
Release of Security Interest Feb 29, 2024
From: JPMORGAN CHASE BANK, N.A.
To: BLACK DIAMOND EQUIPMENT, LTD.
Reel/Frame 066707/0784 →