Patent Assignment
Reel/Frame 031216/0925
Change of Address of Assignee
Recorded: 2013-09-13
Pages: 3
Assignor
HITACHI CHEMICAL CORPORATION, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL CORPORATION, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition of Semi-Ipn Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignor and the Assignee Previously Recorded on Reel 031216 Frame 0925. Assignor(S) Hereby Confirms the Change of Address of Assignee.
Sep 19, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031246/0182 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →