Patent Assignment
Reel/Frame 031246/0182
Corrective Assignment to Correct the Assignor and the Assignee Previously Recorded on Reel 031216 Frame 0925. Assignor(S) Hereby Confirms the Change of Address of Assignee.
Recorded: 2013-09-19
Pages: 6
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition of Semi-Ipn Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address of Assignee
Sep 13, 2013
From: HITACHI CHEMICAL CORPORATION, LTD.
To: HITACHI CHEMICAL CORPORATION, LTD.
Reel/Frame 031216/0925 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →