IP Library Assignment 031237/0792
Patent Assignment
Reel/Frame 031237/0792

Assignment of Assignor's Interest

Recorded: 2013-08-30 Pages: 2
Assignors
SAKATA, MASAKAZU
Executed: 2013-08-09
YANAI, HIDEHIRO
Executed: 2013-08-09
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME,, CHIYODA-KU, TOKYO 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Substrate Supporter and Method of Manufacturing Semiconductor Device
Patent: 9,076,644 →
Application: 13/980,144 →
Publication: US 2014/0004710
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →