Substrate processing apparatus, substrate supporter and method of manufacturing semiconductor device

1. A substrate processing apparatus, comprising:

a process chamber configured to process a substrate:

a gas supply unit configured to supply a processing gas into the process chamber;

a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face;

a heating element arranged in the substrate placement stage and configured to heat the substrate;

a plurality of struts configured to support the flange from below;

an exhaust unit configured to exhaust an atmosphere in the process chamber; and

a supporting member provided between the flange and the plurality of struts,

wherein insertion holds into which upper ends of the struts are inserted from below, are formed to penetrate the supporting member in a vertical direction of the supporting member,

wherein a diameter of a lower portion below the upper end of each of the struts, is formed to be larger than a diameter of the upper end of each of the struts, to thereby form an insertion part into each of the insertion holes, and a collar unit which stops at the supporting member, in each of the struts, and

wherein the struts are configured to support the flange from below via the supporting member, by engaging the supporting member with the collar unit.

2. The substrate processing apparatus according to claim 1 , wherein the supporting member is made of a material having a lower thermal conductivity than that of the substrate placement stage.

3. The substrate processing apparatus according to claim 2 , wherein the substrate placement stage is made of aluminum.

4. The substrate processing apparatus according to claim 3 , wherein the substrate processing apparatus includes a substrate carrier provided in the process chamber and configured to transfer the substrates in the process chamber, and set in a standby mode in the process chamber while processing each substrate;

a surface of the flange is formed to be lower than a height position of the substrate placement surface;

one or a plurality of exhaust holes are formed outside of the substrate placement surface;

a storage space of the substrate carrier is formed between a shortest line connecting the exhaust hole and the upper end portion of the substrate placement stage, and an upper surface of the flange; and

the substrate carrier is stored in the storage space while processing each substrate.

5. The substrate processing apparatus according to claim 2 , wherein the substrate processing apparatus includes a substrate carrier provided in the process chamber and configured to transfer the substrates in the process chamber, and set in a standby mode in the process chamber while processing each substrate;

a surface of the flange is formed to be lower than a height position of the substrate placement surface;

one or a plurality of exhaust holes are formed outside of the substrate placement surface;

a storage space of the substrate carrier is formed between a shortest line connecting the exhaust hole and the upper end portion of the substrate placement stage, and an upper surface of the flange; and

the substrate carrier is stored in the storage space while processing each substrate.

6. The substrate processing apparatus according to claim 1 , wherein the substrate placement stage is made of aluminum.

7. The substrate processing apparatus according to claim 6 , wherein the substrate processing apparatus includes a substrate carrier provided in the process chamber and configured to transfer the substrates in the process chamber, and set in a standby mode in the process chamber while processing each substrate;

a surface of the flange is formed to be lower than a height position of the substrate placement surface;

one or a plurality of exhaust holes are formed outside of the substrate placement surface;

a storage space of the substrate carrier is formed between a shortest line connecting the exhaust hole and the upper end portion of the substrate placement stage, and an upper surface of the flange; and

the substrate carrier is stored in the storage space while processing each substrate.

8. The substrate processing apparatus according to claim 1 , wherein the substrate processing apparatus includes a substrate carrier provided in the process chamber and configured to transfer the substrates in the process chamber, and set in a standby mode in the process chamber while processing each substrate;

a surface of the flange is formed to be lower than a height position of the substrate placement surface;

one or a plurality of exhaust holes are formed outside of the substrate placement surface;

a storage space of the substrate carrier is formed between a shortest line connecting the exhaust hole and the upper end portion of the substrate placement stage, and an upper surface of the flange; and

the substrate carrier is stored in the storage space while processing each substrate.

9. The substrate processing apparatus according to claim 1 , wherein the supporting member has a ring-shape and is provided along a bottom surface of the flange.

10. The substrate processing apparatus according to claim 1 , comprising an exhaust baffle ring disposed on an upper surface of the flange or outside of the flange and having a plurality of hole portions.

11. The substrate processing apparatus according to claim 1 , wherein a side wall of the insertion part is configured to be in contact with an inner wall of the insertion hole in a state of being inserted into the insertion hole.

12. A substrate supporter, comprising:

a substrate placement stage configured to place a substrate on a substrate placement surface, with a flange provided on its side face;

a heating element arranged in the substrate placement stage, and configured to heat the substrate;

a plurality of struts configured to support the flange from below; and

a supporting member provided between the flange and the plurality of struts,

wherein insertion holds into which upper ends of the struts are inserted from below, are formed to penetrate the supporting member in a vertical direction of the supporting member,

wherein a diameter of a lower portion below the upper end of each of the struts, is formed to be larger than a diameter of the upper end of each of the struts, to thereby form an insertion part into each of the insertion holes, and a collar unit which stops at the supporting member, in each of the struts, and

wherein the struts are configured to support the flange from below via the supporting member, by engaging the supporting member with the collar unit.

13. The substrate supporter according to claim 12 , wherein the supporting member has a ring-shape and is provided along a bottom surface of the flange.