Patent Assignment
Reel/Frame 031250/0259
Change of Name
Recorded: 2013-09-20
Pages: 6
Assignor
INTERSIL AMERICAS INC.
Executed: 2011-12-27
Assignee
INTERSIL AMERICAS LLC
1001 MURPHY RANCH ROAD, MILPITAS, CALIFORNIA, 95035
Covered Properties
(5)
Diamond Soi with Thin Silicon Nitride Layer and Related Methods
Methods of Forming a Semiconductor Device
Thermal Matching in Semiconductor Devices Using Heat Distribution Structures
Methods of Forming a Semiconductor Device
Diamond Heat Spreader Structures
Application:
61/286,467 →
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
May 5, 2010
From: INTERSIL CORPORATION; TECHWELL, INC.; INTERSIL COMMUNICATIONS, INC.; QUELLAN, INC.
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 024335/0465 →
Assignment of Assignor's Interest
May 20, 2010
From: JEROME, RICK C; HEBERT, FRANCOIS; MCLACHLAN, CRAIG; HOOPINGARNER, KEVIN
To: INTERSIL AMERICAS INC.
Reel/Frame 024414/0907 →
Assignment of Assignor's Interest
Sep 23, 2010
From: JEROME, RICK C; HEBERT, FRANCOIS; MCLACHLAN, CRAIG; HOOPINGARNER, KEVIN
To: INTERSIL AMERICAS INC.
Reel/Frame 025033/0508 →
Assignment of Assignor's Interest
Dec 13, 2010
From: GAUL, STEPHEN J; VOLDMAN, STEVEN HOWARD; TSCHANN, JEAN-MICHEL
To: INTERSIL AMERICAS INC.
Reel/Frame 025496/0558 →
Assignment of Assignor's Interest
Jan 18, 2011
From: GAUL, STEPHEN J; VOLDMAN, STEVEN HOWARD; TSCHANN, JEAN-MICHEL
To: INTERSIL AMERICAS INC.
Reel/Frame 025654/0939 →
Assignment of Assignor's Interest
Dec 18, 2012
From: JEROME, RICK C.; HEBERT, FRANCOIS; MCLACHLAN, CRAIG; HOOPINGARNER, KEVIN
To: INTERSIL AMERICAS INC.
Reel/Frame 029490/0945 →
Release of Security Interest
Sep 25, 2013
From: MORGAN STANLEY & CO. L.L.C.
To: INTERSIL AMERICAS INC.
Reel/Frame 031275/0676 →
Assignment of Assignor's Interest
Nov 4, 2013
From: INTERSIL AMERICAS LLC
To: SOITEC
Reel/Frame 031539/0709 →