Patent Assignment
Reel/Frame 031275/0676
Release of Security Interest
Recorded: 2013-09-25
Pages: 119
Assignor
MORGAN STANLEY & CO. L.L.C.
Executed: 2012-09-30
Assignee
INTERSIL AMERICAS INC.
1001 MURPHY RANCH ROAD, MILPITAS, CALIFORNIA, 95035
Covered Properties
(3)
Semi-Insulating Wafer
Patent:
5,773,151 →
Application:
08/497,404 →
Diamond Soi with Thin Silicon Nitride Layer and Related Methods
Diamond Heat Spreader Structures
Application:
61/286,467 →
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
May 5, 2010
From: INTERSIL CORPORATION; TECHWELL, INC.; INTERSIL COMMUNICATIONS, INC.; QUELLAN, INC.
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 024335/0465 →
Security Agreement
May 5, 2010
From: INTERSIL CORPORATION; TECHWELL, INC.; INTERSIL COMMUNICATIONS, INC.; QUELLAN, INC.
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 024329/0831 →
Assignment of Assignor's Interest
May 20, 2010
From: JEROME, RICK C; HEBERT, FRANCOIS; MCLACHLAN, CRAIG; HOOPINGARNER, KEVIN
To: INTERSIL AMERICAS INC.
Reel/Frame 024414/0907 →
Release of Security Interest
May 26, 2010
From: CREDIT SUISSE FIRST BOSTON
To: INTERSIL CORPORATION
Reel/Frame 024445/0049 →
Assignment of Assignor's Interest
Jan 18, 2011
From: GAUL, STEPHEN J; VOLDMAN, STEVEN HOWARD; TSCHANN, JEAN-MICHEL
To: INTERSIL AMERICAS INC.
Reel/Frame 025654/0939 →
Change of Name
Sep 20, 2013
From: INTERSIL AMERICAS INC.
To: INTERSIL AMERICAS LLC
Reel/Frame 031250/0259 →
Assignment of Assignor's Interest
Oct 1, 2013
From: INTERSIL COMMUNICATIONS LLC
To: INTERSIL AMERICAS LLC
Reel/Frame 031321/0335 →
Assignment of Assignor's Interest
Nov 4, 2013
From: INTERSIL AMERICAS LLC
To: SOITEC
Reel/Frame 031539/0709 →