Patent Assignment
Reel/Frame 024329/0831
Security Agreement
Recorded: 2010-05-05
Received: 2010-05-05
Pages: 126
Assignors
D2AUDIO CORPORATION
Executed: 2010-04-27
ELANTEC SEMICONDUCTOR, INC.
Executed: 2010-04-27
INTERSIL AMERICAS INC.
Executed: 2010-04-27
INTERSIL COMMUNICATIONS, INC.
Executed: 2010-04-27
INTERSIL CORPORATION
Executed: 2010-04-27
KENET, INC.
Executed: 2010-04-27
PLANET ATE, INC.
Executed: 2010-04-27
QUELLAN, INC.
Executed: 2010-04-27
TECHWELL, INC.
Executed: 2010-04-27
ZILKER LABS, INC.
Executed: 2010-04-27
Assignee
MORGAN STANLEY & CO. INCORPORATED
ONE PIERREPONT PLAZA, 7TH FLOOR, 300 CADMAN PLAZA WEST, BROOKLYN, NY, 11201, UNITED STATES
Covered Properties
(11)
Method of Forming an Integrated Circuit Having a Device Wafer with a Diffused Doped Backside Layer
Application:
11/870,564 →
Edge Termination for Silicon Power Devices
Application:
10/882,387 →
Methods to Control the Droop When Powering Dual Mode Processors and Associated Circuits
Application:
10/668,752 →
Bicmos Process with Low Temperature Coefficient Resistor (Tcrl)
Application:
10/393,181 →
Current Mode Dc/Dc Converter with Controlled Output Impedance
Application:
10/375,914 →
Edge Termination for Silicon Power Devices
Application:
10/327,443 →
Flame Retardant Insulation Composition Having Improved Scorch Resistance
Application:
10/268,636 →
Apparatus and Method for Testing Subscriber Loop Interface Circuits
Application:
10/078,362 →
Current Mode Dc/Dc Converter with Controlled Output Impedance
Application:
10/045,169 →
Edge Termination for Silicon Power Devices
Application:
09/792,345 →
Methods to Control the Droop When Powering Dual Mode Processors and Associated Circuits
Application:
09/791,509 →