Patent Assignment
Reel/Frame 031259/0044
Assignment of Assignor's Interest
Recorded: 2013-09-23
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2011-04-08
CHANG, CHENG-HUNG
Executed: 2011-04-08
LIAO, EBIN
Executed: 2011-04-08
YU, CHIA-LIN
Executed: 2011-04-08
WANG, HSIANG-YI
Executed: 2011-04-08
CHANG, CHUN HUA
Executed: 2011-04-08
HUANG, LI-HSIEN
Executed: 2011-04-08
KUO, DARRYL
Executed: 2011-04-08
WU, TSANG-JIUH
Executed: 2011-04-08
CHIOU, WEN-CHIH
Executed: 2011-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Component Having Through-Silicon Vias and Method of Manufacture