Semiconductor component having through-silicon vias and method of manufacture

1. A semiconductor component comprising:

a semiconductor substrate having an opening, wherein the opening has a top portion and a bottom portion;

a first dielectric liner disposed over an interior surface of the opening, the first dielectric liner having a thickness T 1 on the top portion and a thickness T 2 on the bottom portion, wherein R 1 is a ratio of T 1 to T 2 ;

a second dielectric liner disposed over the first dielectric liner, the second dielectric liner having a thickness T 3 on the top portion and a thickness T 4 on the bottom portion, wherein R 2 is a ratio of T 3 to T 4 , and R 1 is greater than R 2 ; and

a conductive material disposed over the second dielectric liner.

2. The semiconductor component of claim 1 , wherein R 1 ranges from about 5 to about 20.

3. The semiconductor component of claim 1 , wherein the semiconductor substrate has a thickness ranging from about 10 microns (μm) to about 200 μm.

4. The semiconductor component of claim 1 , wherein R 2 ranges from about 1 to about 5.

5. The semiconductor component of claim 1 , further comprising a third dielectric liner between the second dielectric liner and the conductive material, the third dielectric liner has a thickness T 5 on the top portion and a thickness T 6 on the bottom portion, wherein R 3 is a ratio of T 5 to T 6 , and R 3 is greater than R 2 .

6. The semiconductor component of claim 5 , wherein R 3 ranges from about 5 to about 20.

7. The semiconductor component of claim 5 , wherein an etching rate of the first dielectric liner in an HF solution is different from an etching rate of the second dielectric liner in the HF solution.