Assignment of Assignor's Interest

Recorded: 2013-09-23 Pages: 3

Assignor

MATSUNO, NORIAKI

Executed: 2013-09-10

Assignee

RENESAS ELECTRONICS CORPORATION

1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Semiconductor Device, Method of Manufacturing Semiconductor Device, and Soi Substrate

Application: 14/006,939 →

Publication: US 2014/0015091

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.