Patent Assignment
Reel/Frame 046390/0398
Address Change
Recorded: 2018-06-19
Pages: 7
Assignor
RENESAS ELECTRONICS CORPORATION
Executed: 2015-07-31
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, JAPAN
Covered Properties
(14)
Semiconductor Device and Method for Manufacturing the Same
Application:
13/165,343 →
Publication:
US 2011/0309466
Semiconductor Device and Method for Manufacturing Same
Application:
13/805,252 →
Publication:
US 2013/0087828
Processor and Instruction Processing Method of Processor
Application:
14/006,950 →
Publication:
US 2014/0019722
Semiconductor Device, Method of Manufacturing Semiconductor Device, and Soi Substrate
Application:
14/006,939 →
Publication:
US 2014/0015091
Solid-State Image Pickup Device with Plurality of Converters
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device with Silicon Layer Containing Carbon
Output Circuit
Memory with Termination Circuit
Semiconductor Device
Data Processing System
Method of Manufacturing Semiconductor Device
Operational Amplifying Circuit and Liquid Crystal Panel Drive Device Using the Same
Information Processing Apparatus
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 22, 2011
From: NANBA, HIROAKI
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026474/0872 →
Assignment of Assignor's Interest
Dec 19, 2012
From: KOSHIMIZU, MAKOTO; NIWAYAMA, HIDEKI; UMEZU, KAZUYUKI; SOEDA, HIROKI
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 029499/0477 →
Assignment of Assignor's Interest
Sep 23, 2013
From: MATSUNO, NORIAKI
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 031261/0553 →
Assignment of Assignor's Interest
Sep 23, 2013
From: NAGAO, TSUYOSHI; SATO, JUNICHI
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 031261/0668 →