Patent Assignment
Reel/Frame 031278/0541
Assignment of Assignor's Interest
Recorded: 2013-09-25
Pages: 6
Assignors
HIROSE, YOSHIRO
Executed: 2013-07-17
TAKASAWA, YUSHIN
Executed: 2013-07-29
KAMAKURA, TSUKASA
Executed: 2013-07-17
NAKAMURA, YOSHINOBU
Executed: 2013-07-17
SASAJIMA, RYOTA
Executed: 2013-07-22
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1, SOTOKANDA 4-CHOME,, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate and Substrate Processing Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.