Assignment of Assignor's Interest

Recorded: 2013-09-25 Pages: 9

Assignors

CHI, HEEJO

Executed: 2013-09-24

SHIN, HANGIL

Executed: 2013-09-24

CHO, NAMJU

Executed: 2013-09-24

KIM, KYUNG MOON

Executed: 2013-09-25

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Integrated Circuit Packaging System with Single Metal Layer Interposer and Method of Manufacture Thereof

Patent: 9,299,650 →

Application: 14/037,274 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.