Assignment of Assignor's Interest

Recorded: 2013-09-27 Pages: 9

Assignors

KIM, KYUNGHWAN

Executed: 2013-09-26

YANG, DEOKKYUNG

Executed: 2013-09-25

MUN, SEONGHUN

Executed: 2013-09-25

LEE, KEOCHANG

Executed: 2013-09-25

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Methods of Mitigating Defects for Semiconductor Packages

Patent: 9,184,067 →

Application: 14/039,276 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.