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Patent Assignment
Reel/Frame 031319/0005

Assignment of Assignor's Interest

Recorded: 2013-10-01 Pages: 3
Assignor
FUJITSU LIMITED
Executed: 2010-02-18
Assignee
FUJITSU MICROELECTRONICS LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property (1)
Low-Noise Flip-Chip Packages and Flip Chips Thereof
Patent: 8,637,999 →
Application: 13/566,581 →
Publication: US 2012/0326335
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 9, 2012
From: DEDIC, IAN JUSO; ALI, GHAZANFER
To: FUJITSU LIMITED
Reel/Frame 028756/0554 →
Change of Name Oct 2, 2013
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 031326/0570 →
Assignment of Assignor's Interest Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0637 →