IP Library › Assignment 031326/0570
Patent Assignment
Reel/Frame 031326/0570

Change of Name

Recorded: 2013-10-02 Pages: 17
Assignor
FUJITSU MICROELECTRONICS LIMITED
Executed: 2010-04-01
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property (1)
Low-Noise Flip-Chip Packages and Flip Chips Thereof
Patent: 8,637,999 →
Application: 13/566,581 →
Publication: US 2012/0326335
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 9, 2012
From: DEDIC, IAN JUSO; ALI, GHAZANFER
To: FUJITSU LIMITED
Reel/Frame 028756/0554 →
Assignment of Assignor's Interest Oct 1, 2013
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 031319/0005 →
Assignment of Assignor's Interest Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0637 →