IP Library › Assignment 031340/0039
Patent Assignment
Reel/Frame 031340/0039

Assignment of Assignor's Interest

Recorded: 2013-10-03 Pages: 4
Assignors
HWANG, CHIEN LING
Executed: 2013-09-13
JANG, BOR-PING
Executed: 2013-09-13
LIAO, HSIN-HUNG
Executed: 2013-09-13
LIN, YEONG-JYH
Executed: 2013-09-13
LIANG, HSIAO-CHUNG
Executed: 2013-09-13
LIU, CHUNG-SHI
Executed: 2013-09-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Methods for Controlling Warpage in Packaging
Patent: 9,093,337 →
Application: 14/040,160 →
Publication: US 2015/0093858
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Third Inventor's First Name Previously Recorded on Reel 031340 Frame 0039. Assignor(S) Hereby Confirms the Assignment of the Assignor's Interest. Jan 10, 2020
From: HWANG, CHIEN LING; JANG, BOR-PING; LIAO, JEN-CHUN; LIN, YEONG-JYH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 051565/0394 →