IP Library › Assignment 051565/0394
Patent Assignment
Reel/Frame 051565/0394

Corrective Assignment to Correct the Third Inventor's First Name Previously Recorded on Reel 031340 Frame 0039. Assignor(S) Hereby Confirms the Assignment of the Assignor's Interest.

Recorded: 2020-01-10 Pages: 7
Assignors
HWANG, CHIEN LING
Executed: 2019-12-17
JANG, BOR-PING
Executed: 2020-01-07
LIAO, JEN-CHUN
Executed: 2019-12-23
LIN, YEONG-JYH
Executed: 2019-12-17
LIANG, HSIAO-CHUNG
Executed: 2019-12-30
LIU, CHUNG-SHI
Executed: 2019-12-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Methods for Controlling Warpage in Packaging
Patent: 9,093,337 →
Application: 14/040,160 →
Publication: US 2015/0093858
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 3, 2013
From: HWANG, CHIEN LING; JANG, BOR-PING; LIAO, HSIN-HUNG; LIN, YEONG-JYH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 031340/0039 →