Patent Assignment
Reel/Frame 031344/0360
Corrective Assignment to Correct the Execution Date of Michael G. Kelly Previously Recorded on Reel 029311 Frame 0429. Assignor(S) Hereby Confirms the Michael G. Kelly Execution Date Previously Recorded as 01/08/2012 but Should Be 11/08/2012.
Recorded: 2013-10-04
Pages: 11
Assignors
KELLY, MICHAEL G.
Executed: 2012-11-08
HUEMOELLER, RONALD PATRICK
Executed: 2012-11-07
HINER, DAVID JON
Executed: 2012-11-07
DO, WON CHUL
Executed: 2012-11-14
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Method And System For A Semiconductor Device Package With A Die To Interposer Wafer First Bond
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 16, 2012
From: KELLY, MICHAEL G.; HUEMOELLER, RONALD PATRICK; HINER, DAVID JON; DO, WON CHUL
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 029311/0429 →
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →