Patent Assignment
Reel/Frame 031350/0373
Assignment of Assignor's Interest
Recorded: 2013-10-04
Pages: 6
Assignors
CHOI, HWA SEOB
Executed: 2013-09-24
JANG, YU SUNG
Executed: 2013-09-24
EUM, TAI YOUNG
Executed: 2013-09-24
LEE, JEE HO
Executed: 2013-09-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Device