Patent Assignment
Reel/Frame 031466/0152
Assignment of Assignor's Interest
Recorded: 2013-10-15
Pages: 6
Assignors
HABA, BELGACEM
Executed: 2013-05-14
HONER, KENNETH ALLEN
Executed: 2013-06-25
TUCKERMAN, DAVID B.
Executed: 2013-08-07
OGANESIAN, VAGE
Executed: 2013-08-09
Assignee
DIGITALOPTICS CORPORATION EUROPE LIMITED
CLIONA, BUILDING ONE, PARKMORE EAST BUSINESS PARK, BALLYBRIT, GALWAY, IRELAND
Covered Property
(1)
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 20, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030065/0817 →
Assignment of Assignor's Interest
Oct 16, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: INVENSAS CORPORATION
Reel/Frame 031483/0896 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →