Patent Assignment
Reel/Frame 031483/0896
Assignment of Assignor's Interest
Recorded: 2013-10-16
Pages: 16
Assignor
DIGITALOPTICS CORPORATION EUROPE LIMITED
Executed: 2013-03-18
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Chips Having Rear Contacts Connected by Through Vias to Front Contacts
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 20, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030065/0817 →
Assignment of Assignor's Interest
Oct 15, 2013
From: HABA, BELGACEM; HONER, KENNETH ALLEN; TUCKERMAN, DAVID B.; OGANESIAN, VAGE
To: DIGITALOPTICS CORPORATION EUROPE LIMITED
Reel/Frame 031466/0152 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →