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Patent Assignment
Reel/Frame 031513/0900

Assignment of Assignor's Interest

Recorded: 2013-10-30 Pages: 4
Assignors
CHAE, EUN HYUK
Executed: 2013-09-26
LEE, BYOUNG HWA
Executed: 2013-09-26
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Ceramic Electronic Part to Be Embedded in Board and Printed Circuit Board Having Multilayer Ceramic Electronic Part Embedded Therein
Patent: 9,230,740 →
Application: 14/067,734 →
Publication: US 2015/0021077