Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on a portion of the first base electrode formed on at least one of the first and second main surfaces of the ceramic body, the second external electrode includes a second base electrode and a second terminal electrode formed on a portion of the second base electrode formed on at least one of the first and second main surfaces of the ceramic body.
1. A multilayer ceramic electronic part to be embedded in a board, comprising:
a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other;
first and second internal electrodes alternately exposed through the end surfaces of the ceramic body, having the dielectric layer disposed therebetween; and
first and second external electrodes formed on both end portions of the ceramic body,
wherein the first external electrode has a two layer structure consisting of:
a first base electrode electrically connected to the first internal electrode and formed on the first end surface and at least one of the first and second main surfaces of the ceramic body, and
a first terminal electrode formed on a portion of the first base electrode and formed only on at least one of the first and second main surfaces of the ceramic body,
wherein the second external electrode has a two layer structure consisting of:
a second base electrode electrically connected to the second internal electrode and formed on the second end surface and at least one of the first and second main surfaces of the ceramic body, and
a second terminal electrode formed on a portion of the second base electrode and formed only on at least one of the first and second main surfaces of the ceramic body,
the first and second base electrodes are formed of a first conductive metal and glass, and
the first and second terminal electrodes are formed of a second conductive metal not containing glass.
2. The multilayer ceramic electronic part of claim 1 , wherein the first conductive metal is at least one selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.
3. The multilayer ceramic electronic part of claim 1 , wherein the second conductive metal is copper (Cu).
4. A multilayer ceramic electronic part to be embedded in a board, comprising:
a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other;
first and second internal electrodes laminated in the ceramic body with the dielectric layer disposed therebetween, being spaced apart from the end surfaces of the ceramic body by a predetermined distance, and having a lead exposed to at least one of the first and second side surfaces of the ceramic body; and
first and second external electrodes formed on both end portions of the ceramic body,
wherein the first external electrode has a two layer structure consisting of:
a first base electrode electrically connected to the first internal electrode and formed on the first end surface and at least one of the first and second main surfaces of the ceramic body, and
a first terminal electrode formed on a portion of the first base electrode and formed only on at least one of the first and second main surfaces of the ceramic body,
wherein the second external electrode has a two layer structure consisting of:
a second base electrode electrically connected to the second internal electrode and formed on the second end surface and at least one of the first and second main surfaces of the ceramic body, and
a second terminal electrode formed on a portion of the second base electrode and formed only on at least one of the first and second main surfaces of the ceramic body,
the first and second base electrodes are formed of a first conductive metal and glass, and
the first and second terminal electrodes are formed of a second conductive metal not containing glass.
5. The multilayer ceramic electronic part of claim 4 , wherein the first conductive metal is at least one selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.
6. The multilayer ceramic electronic part of claim 4 , wherein the second conductive metal is copper (Cu).
7. A printed circuit board having a multilayer ceramic electronic part embedded therein, the printed circuit board comprising:
an insulating substrate; and
the multilayer ceramic electronic part including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other and first and second end surfaces facing each other, first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer disposed therebetween, and first and second external electrodes formed on both end portions of the ceramic body,
wherein the first external electrode has a two layer structure consisting of:
a first base electrode electrically connected to the first internal electrode and formed on the first end surface and at least one of the first and second main surfaces of the ceramic body, and
a first terminal electrode formed on a portion of the first base electrode and formed only on at least one of the first and second main surfaces of the ceramic body,
wherein the second external electrode has a two layer structure consisting of:
a second base electrode electrically connected to the second internal electrode and formed on the second end surface and at least one of the first and second main surfaces of the ceramic body, and
a second terminal electrode formed on a portion of the second base electrode and formed only on at least one of the first and second main surfaces of the ceramic body,
the first and second base electrodes are formed of a first conductive metal and glass, and
the first and second terminal electrodes are formed of a second conductive metal not containing glass.
8. The printed circuit board of claim 7 , wherein the first conductive metal is at least one selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.
9. The printed circuit board of claim 7 , wherein the second conductive metal is copper (Cu).