Patent Assignment
Reel/Frame 031532/0399
Assignment of Assignor's Interest
Recorded: 2013-11-01
Pages: 7
Assignors
YOU, KWANG SUN
Executed: 2013-10-31
LEE, SEUNG RYEOL
Executed: 2013-10-31
PARK, SANG HOON
Executed: 2013-10-31
HEO, KYUNG JIN
Executed: 2013-10-31
SHIN, JAE HO
Executed: 2013-10-31
JUNG, JOONG HYUK
Executed: 2013-10-31
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Printed Circuit Board