Method for manufacturing printed circuit board
Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.
1. A method for manufacturing a printed circuit board, the method comprising:
preparing a base substrate having a circuit layer formed on one surface thereof or the other surface thereof; the circuit layer including an inner layer pad and a circuit pattern;
forming an insulating layer for stripping on an outer surface of the inner layer pad in the circuit layer;
forming a first insulating layer on the base substrate as well as the insulating layer for stripping and the circuit layer, the first insulating layer having an open part corresponding to the insulating layer for stripping;
forming a copper clad laminate (CCL) layer on the first insulating layer so that a first metal layer for a stopper contacts an upper surface of the insulating layer for stripping exposed through the open part;
performing cavity processing so that an edge region in an upper surface of the first metal layer is exposed by performing laser processing on the CCL layer;
removing the exposed first metal layer in a thickness direction;
removing the insulating layer for stripping exposed by removing the first metal layer in the thickness direction;
separating the first metal layer contacting the insulating layer for stripping and the insulating layer for stripping from each other; and
removing the insulating layer for stripping.
2. The method as set forth in claim 1 , wherein a diameter of the first metal layer formed to contact the upper surface of the insulating layer for stripping is formed to be larger than that of the insulating layer for stripping, in a length direction of the substrate.
3. The method as set forth in claim 1 , wherein in the forming of the first insulating layer, the first insulating layer is made of a no-flow prepreg material.
4. The method as set forth in claim 1 , wherein in the forming of the first insulating layer, the first insulating layer is in a cured state.
5. The method as set forth in claim 1 , further comprising, after the forming of the CCL layer and before the performing of the cavity processing, forming a second insulating layer on the CCL layer and forming a second metal layer on the second insulating layer.
6. The method as set forth in claim 5 , further comprising, after the forming of the second metal layer, patterning the second metal layer.
7. The method as set forth in claim 5 , wherein in the performing of the cavity processing, the cavity processing is performed on the second metal layer, the second insulating layer, and the CCL layer.
8. The method as set forth in claim 5 , wherein in the forming of the second insulating layer, the second insulating layer is made of a prepreg material.
9. The method as set forth in claim 1 , wherein in the removing of the insulating layer for stripping in the thickness direction, the insulating layer for stripping is removed using a stripping solution of sodium hydroxide (NaOH) or potassium hydroxide (KOH).
10. A method for manufacturing a printed circuit board, the method comprising:
preparing a base substrate having a circuit layer formed on one surface thereof or the other surface thereof, the circuit layer including an inner layer pad and a circuit pattern;
forming an insulating layer for stripping on an outer surface of the inner layer pad in the circuit layer;
forming a first insulating layer on the base substrate as well as the insulating layer for stripping and the circuit layer, the first insulating layer having an open part corresponding to the insulating layer for stripping;
forming a CCL layer on the first insulating layer so that a first metal layer for a stopper formed on the CCL layer contacts an upper surface of the insulating layer for stripping exposed through the open part;
forming a second insulating layer on the CCL layer;
forming a second metal layer on the second insulating layer;
performing cavity processing so that an edge region in an upper surface of the first metal layer is exposed by performing laser processing on the CCL layer, the second insulating layer, and the second metal layer;
removing the exposed first metal layer in a thickness direction;
removing the insulating layer for stripping exposed by removing the first metal layer in the thickness direction;
separating the first metal layer contacting the insulating layer for stripping and the insulating layer for stripping from each other; and
removing the insulating layer for stripping,
wherein, the first insulating layer is in a cured state.
11. The method as set forth in claim 10 , wherein a diameter of the first metal layer formed to contact the upper surface of the insulating layer for stripping is formed to be larger than that of the insulating layer for stripping, in a length direction of the substrate.
12. The method as set forth in claim 10 , wherein in the forming of the first insulating layer, the first insulating layer is made of a no-flow prepreg material.
13. The method as set forth in claim 10 , wherein in the forming of the first insulating layer, the first insulating layer is in a cured state.
14. The method as set forth in claim 10 , further comprising, after the forming of the second metal layer, patterning the second metal layer.
15. The method as set forth in claim 10 , wherein in the forming of the second insulating layer, the second insulating layer is made of a prepreg material.
16. The method as set forth in claim 10 , wherein in the removing of the insulating layer for stripping in the thickness direction, the insulating layer for stripping is removed using a stripping solution of sodium hydroxide (NaOH) or potassium hydroxide (KOH).