Patent Assignment
Reel/Frame 031551/0129
Assignment of Assignor's Interest
Recorded: 2013-11-06
Pages: 5
Assignors
LEE, KYOUNG YEON
Executed: 2013-11-01
KIM, BYONG JIN
Executed: 2013-11-01
BAE, JAE MIN
Executed: 2013-10-30
JEON, HYUNG IL
Executed: 2013-11-01
KIM, GI JEONG
Executed: 2013-11-01
CHUNG, JI YOUNG
Executed: 2013-11-01
Assignee
AMKOR TECHNOLOGY, INC.
1900 S PRICE ROAD, CHANDLER, ARIZONA, 85286
Covered Property
(1)
Land Structure for Semiconductor Package and Method Therefor
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →