Patent Assignment
Reel/Frame 031594/0871
Assignment of Assignor's Interest
Recorded: 2013-11-13
Pages: 4
Assignor
JEON, IN GYUN
Executed: 2013-11-11
Assignee
SILICONFILE TECHNOLOGIES INC.
20F BUNDANG SQUARE, 263 SEOHYEON-DONG, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO, 463-050, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Electrically Connecting Wafers Using Butting Contact Structure and Semiconductor Device Fabricated Through the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.