Patent Assignment
Reel/Frame 031609/0001
Assignment of Assignor's Interest
Recorded: 2013-11-15
Pages: 2
Assignors
LIN, YI-TANG
Executed: 2013-08-12
WANN, CLEMENT HSINGJEN
Executed: 2013-08-19
CHEN, NENG-KUO
Executed: 2013-08-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Inter-Level Connection for Multi-Layer Structures