Patent Assignment
Reel/Frame 031630/0203
Assignment of Assignor's Interest
Recorded: 2013-11-13
Pages: 4
Assignors
TSAI, CHUNG-HAO
Executed: 2013-09-30
LAI, WEI-CHIH
Executed: 2013-09-30
WANG, CHUEI-TANG
Executed: 2013-09-30
YU, CHEN-HUA
Executed: 2013-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device with Shielding Layer in Post-Passivation Interconnect Structure