Semiconductor device with shielding layer in post-passivation interconnect structure
A semiconductor device includes a semiconductor substrate, a dielectric layer, a passivation layer, a protective layer, a post-passivation interconnect (PPI) structure, and a shielding layer. The semiconductor substrate has electrical circuitry. The dielectric layer is formed on the semiconductor substrate. The passivation layer is formed on the dielectric layer. The first protective layer is formed on the passivation layer. The PPI structure is disposed on the first protective layer and has a signal line and a ground line. The shielding layer is disposed over the semiconductor substrate and between the signal line and the electrical circuitry. The shielding layer is substantially equi-potentially connected to the ground line of the PPI structure.
1. A semiconductor device, comprising:
a semiconductor substrate comprising electrical circuitry, an inter-metal dielectric layer over the electrical circuitry, and a contact pad formed on and in contact with the inter-metal dielectric layer;
a passivation layer overlying the inter-metal dielectric layer;
a first protective layer overlying the passivation layer;
a post-passivation interconnect (PPI) structure overlying the first protective layer and comprising at least one signal line and a first ground line spaced apart from the signal line;
a first shielding layer interposed between the inter-metal dielectric layer and the passivation layer, wherein the first shielding layer extends on and in contact with the inter-metal dielectric layer such that the first shielding layer is between the signal line and the electrical circuitry, and the first shielding layer is substantially equi-potentially connected to the first ground line of the PPI structure;
a second protective layer covering the PPI structure and in contact with the first protective layer, wherein both the first and the second protective layers are made of polymeric material; and
a second shielding layer formed over and in contact with the second protective layer, wherein the second shielding layer overlaps the first shielding layer and is physically connected to the first ground line, and wherein the signal line and the first ground line are interposed between first shielding layer and the second shielding layer.
2. The semiconductor device according to claim 1 , wherein the contact pad is spaced apart from the first shielding layer, and the first shielding layer and the contact pad comprise the same material.
3. The semiconductor device according to claim 1 , wherein the first shielding layer extends on the same level as and spaced apart from the contact pad.
4. The semiconductor device according to claim 1 , wherein the passivation layer has a first opening exposing a portion of the first shielding layer, and the first protective layer has a second opening exposing the exposed portion of the first shielding layer.
5. The semiconductor device according to claim 4 , wherein the first ground line of the PPI structure is through the first and the second openings connected to the first shielding layer on the inter-metal dielectric layer.
6. The semiconductor device according to claim 1 , wherein the PPI structure further comprises a second ground line that is substantially equi-potentially connected to the first shielding layer, wherein the signal line is positioned between the first ground line and the second ground line.
7. The semiconductor device according to claim 6 , wherein the signal line, the first ground line and the second ground line are formed at a same level over the semiconductor substrate.
8. The semiconductor device according to claim 1 , wherein the first shielding layer overlaps the signal line and the second shielding layer.
9. The semiconductor device according to claim 1 , wherein the PPI structure further comprises a second ground line that is substantially equi-potentially connected to the first shielding layer and the second shielding layer, wherein the signal line is positioned between the first ground line and the second ground line.
10. The semiconductor device according to claim 1 , further comprising a third shielding layer buried in the inter-metal dielectric layer, wherein the third shielding layer is substantially equi-potentially connected to first shielding layer.
11. The semiconductor device according to claim 1 , wherein the first shielding layer is buried in the inter-metal dielectric layer over the semiconductor substrate.
12. The semiconductor device according to claim 1 , wherein the first shielding layer is formed on the first protective layer.
13. The semiconductor device according to claim 1 , wherein each of the signal line and the first ground line comprises copper.
14. A semiconductor device, comprising:
a semiconductor substrate comprising electrical circuitry, an inter-metal dielectric layer over the electrical circuitry, and a contact pad formed on and in contact with the inter-metal dielectric layer;
a passivation layer disposed on and in contact with the inter-metal dielectric layer and the contact pad;
a first protective layer covering the passivation layer and having a first opening;
a redistribution line disposed on the first protective layer and physically in direct contact with the contact pad through the first opening;
a first shielding layer extends on and in contact with the first protective layer, wherein the first shielding layer extends on a level that is higher the contact pad and is physically in direct contact with the contact pad, and wherein the first shielding layer and the redistribution line extend on the same level;
a second protective layer disposed over the first shielding layer and the redistribution line; and
a post-passivation interconnect (PPI) structure overlying the second protective layer and comprising at least one signal line and at least one ground line in contact with the first shielding layer, wherein the first shielding layer laterally extends to cover up an entire projection area of the signal line on the inter-metal dielectric layer.
15. A semiconductor device, comprising:
a semiconductor substrate including electrical circuitry, an inter-metal dielectric layer over the electrical circuitry, and a contact pad formed on and in contact with the inter-metal dielectric layer;
a first shielding layer extending on and in contact with the inter-metal dielectric layer;
a passivation layer disposed on the inter-metal dielectric layer and the first shielding layer;
a first polymeric layer overlying the passivation layer;
a redistribution layer (RDL) structure overlying the first polymeric layer and comprising a signal line electrically connected to the contact pad and a ground line spaced apart from the signal line;
a second polymeric layer covering the signal line and the ground line; and
a second shielding layer extending on the second polymeric layer, wherein the first shielding layer and the second shielding layer are equi-potentially connected to the ground line, and the signal line and the ground line are sandwiched between the first and the shielding layers.