Patent Assignment
Reel/Frame 031630/0937
Assignment of Assignor's Interest
Recorded: 2013-11-19
Pages: 7
Assignors
KWON, HEUNG-KYU
Executed: 2013-11-07
LEE, SEOK-WON
Executed: 2013-11-07
KIM, HYON-CHOL
Executed: 2013-11-07
LEE, SU-CHANG
Executed: 2013-11-07
LEE, CHI-YOUNG
Executed: 2013-11-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Warpage Compensation