IP Library › Assignment 031637/0682
Patent Assignment
Reel/Frame 031637/0682

Assignment of Assignor's Interest

Recorded: 2013-11-20 Pages: 2
Assignors
PARK, DO HYUN
Executed: 2013-11-08
KIM, KYU BONG
Executed: 2013-11-12
LIM, WOO JUN
Executed: 2013-11-11
Assignee
CHEIL INDUSTRIES, INC.
290 GONGDAN-DONG, GUMI-SI, KYEONGSANGBUK-DO, 730-030, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device Bonded by Anisotropic Conductive Film
Patent: 9,142,525 →
Application: 14/084,741 →
Publication: US 2014/0138828
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 7, 2019
From: SAMSUNG SDI CO., LTD.
To: KUDKO CHEMICAL CO., LTD.
Reel/Frame 050640/0740 →
Merger and Change of Name Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
Assignment of Assignor's Interest Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →
Merger Mar 26, 2025
From: KUKDO ADVANCED MATERIALS CO., LTD.
To: KUKDO CHEMICAL CO., LTD.
Reel/Frame 070646/0572 →