Patent Assignment
Reel/Frame 031666/0303
Assignment of Assignor's Interest
Recorded: 2013-11-25
Pages: 5
Assignors
LIN, HSIU-JEN
Executed: 2013-11-12
LU, WEN-HSIUNG
Executed: 2013-11-12
CHEN, CHENG-TING
Executed: 2013-11-12
KUO, HSUAN-TING
Executed: 2013-11-12
CHEN, WEI-YU
Executed: 2013-11-12
CHENG, MING-DA
Executed: 2013-11-12
LIU, CHUNG-SHI
Executed: 2013-11-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Packaging and Manufacturing Method Thereof