Patent Assignment
Reel/Frame 031707/0051
Assignment of Assignor's Interest
Recorded: 2013-12-03
Pages: 2
Assignors
CHEN, JIE
Executed: 2013-11-19
CHEN, HSIEN-WEI
Executed: 2013-11-19
CHEN, YING-JU
Executed: 2013-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Contact Pad for Semiconductor Devices