Patent Assignment
Reel/Frame 031720/0723
Assignment of Assignor's Interest
Recorded: 2013-12-05
Pages: 3
Assignors
CHING, KUO-CHENG
Executed: 2013-11-19
HUANG, JIUN-JIA
Executed: 2013-11-19
WANG, CHAO-HSIUNG
Executed: 2013-11-21
LIU, CHI-WEN
Executed: 2013-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Fin Structure of Semiconductor Device