Patent Assignment
Reel/Frame 031725/0898
Assignment of Assignor's Interest
Recorded: 2013-12-05
Pages: 7
Assignors
KIM, JAE YOON
Executed: 2013-10-10
LEE, SEUNG JAE
Executed: 2013-10-10
SON, HA YEONG
Executed: 2013-10-10
HONG, JIN GI
Executed: 2013-10-10
HWANG, SEONG DEOK
Executed: 2013-10-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Grinding Substrate and Method of Manufacturing Semiconductor Light Emitting Device Using the Same