Patent Assignment
Reel/Frame 031726/0857
Assignment of Assignor's Interest
Recorded: 2013-12-05
Pages: 5
Assignors
ISHIZAKA, TADAHIRO
Executed: 2013-11-19
SUZUKI, KENJI
Executed: 2013-11-19
SHIMADA, ATSUSHI
Executed: 2013-11-19
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method for Forming Copper Wiring