Patent Assignment
Reel/Frame 031762/0716
Assignment of Assignor's Interest
Recorded: 2013-12-11
Pages: 3
Assignors
LEI, WEI-SHENG
Executed: 2013-12-03
EATON, BRAD
Executed: 2013-12-03
KUMAR, AJAY
Executed: 2013-12-03
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Dicing from Wafer Backside and Front Side