Patent Assignment
Reel/Frame 031776/0757
Assignment of Assignor's Interest
Recorded: 2013-12-13
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Brush Cleaning Apparatus, Chemical-Mechanical Polishing (Cmp) System and Wafer Processing Method