Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method

1. A brush cleaning apparatus, comprising:

a wafer support configured to support a wafer;

at least one planar cleaning brush moveable relative to the wafer support, the at least one planar cleaning brush having opposite first and second sides, and on the first side, a planar cleaning surface defined by a layer of porous material and configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer, wherein an entirety of the planar cleaning surface of the at least one planar cleaning brush is configured to simultaneously contact the wafer;

on the second side, a layer of core material having a first flat surface attached to the layer of porous material and having a second flat surface facing away from the layer of porous material; and

wherein interior sidewalls of the layer of core material and the layer of porous material are aligned along lines to collectively define a plurality of holes respectively extending through both the layer of porous material and the layer of core material, wherein the plurality of holes are arranged in circular patterns, when viewed from a top-view of the at least one planar cleaning brush, which are concentric about a point at the center of the at least one planar cleaning brush.

2. The brush cleaning apparatus of claim 1 , wherein the porous material has a porosity in a range from 20% to 60%.

3. The brush cleaning apparatus of claim 2 , wherein the porous material comprises at least one selected from the group consisting of polyvinyl alcohol (PVA), polyamide (PA), polyurethane (PU), polybutylene terephthalate (PBT), and polyethylene terephthalate (PET).

4. The brush cleaning apparatus of claim 2 , wherein the plurality of holes are separated by smaller distances within the circular patterns than between adjacent ones of the circular patterns.

5. The brush cleaning apparatus of claim 2 , wherein the at least one planar cleaning brush has a size that is greater than a size of the wafer.

6. The brush cleaning apparatus of claim 2 , wherein the layer of porous material has a smaller diameter than the core material.

7. The brush cleaning apparatus of claim 6 , wherein the layer of core material comprises at least one selected from the group consisting of polypropene (PP), polythene (PE), and polyvinyl chloride (PVC).

8. The brush cleaning apparatus of claim 1 , wherein the interior sidewalls of the layer of core material and the layer of porous material continuously extend along the lines from the planar cleaning surface to the second flat surface.

9. The brush cleaning apparatus of claim 1 , wherein the plurality of holes has an average hole size in a range from 0.1 mm to 2.5 mm.

10. The brush cleaning apparatus of claim 9 , wherein the plurality of holes is arranged at a hole pitch in a range from 2 to 5 times of the average hole size.

11. The brush cleaning apparatus of claim 1 , further comprising:

at least one nozzle configured to apply a cleaning liquid directly onto the second side of the at least one planar cleaning brush that faces away from the wafer.

12. A brush cleaning apparatus, comprising:

a wafer support configured to support a wafer;

at least one cleaning brush comprising a porous material having a planar cleaning surface configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer, wherein the planar cleaning surface is disposed along an uppermost surface of the porous material and extends as a continuous surface between outermost sidewalls of the porous material and wherein the porous material is coupled to a core material having interior sidewalls that define a plurality of holes arranged in circular patterns that are concentric about a center of the planar cleaning surface when viewed from a top-view of the planar cleaning surface;

a moving mechanism configured to cause a relative translational movement between the wafer and the cleaning brush; and

at least one nozzle configured to supply a cleaning liquid between the wafer and the cleaning brush.

13. The brush cleaning apparatus of claim 12 , wherein the plurality of holes are separated by smaller distances within the circular patterns than between adjacent ones of the circular patterns.

14. The brush cleaning apparatus of claim 12 , wherein the at least one cleaning brush comprises a pair of cleaning brushes for simultaneously cleaning opposite surfaces of the wafer.

15. The brush cleaning apparatus of claim 12 , wherein the at least one cleaning brush is configured to perform a cleaning operation that does not substantially reduce a thickness of the wafer.

16. The brush cleaning apparatus of claim 12 ,

wherein the core material is coupled to a side of the porous material opposing the planar cleaning surface;

wherein the porous material has an outermost sidewall that is laterally set back from an outermost sidewall of the core material; and

wherein the interior sidewalls of the core material and interior sidewalls of the porous material are aligned along lines that are perpendicular to the planar cleaning surface to define a plurality of holes respectively extending completely through the porous material and the core material.

17. A brush cleaning apparatus, comprising:

a wafer support configured to support a wafer;

a planar cleaning brush moveable relative to the wafer support, the planar cleaning brush having opposite first and second sides;

wherein the first side comprises a planar cleaning surface defined by a planar topmost surface of a layer of porous material and configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer;

wherein the second side comprises a planar bottommost surface of a layer of core material and faces away from the layer of porous material, the layer of core material further comprising a topmost surface attached to a bottommost surface of the layer of porous material; and

wherein interior sidewalls of the layer of core material and the layer of porous material collectively define a plurality of holes respectively extending through both the layer of porous material and the layer of core material, wherein the plurality of holes are configured to transfer a cleaning liquid, which is dispensed directly onto the planar bottommost surface of the layer of core material, from the planar bottommost surface of the layer of core material to the planar topmost surface of the layer of porous material.

18. The brush cleaning apparatus of claim 17 , further comprising:

a nozzle configured to dispense the cleaning liquid directly onto the planar bottommost surface of the layer of core material, the planar cleaning brush is directly between the wafer and the nozzle.

19. The brush cleaning apparatus of claim 18 , wherein a line that is perpendicular to the planar topmost surface of the layer of porous material extends from the nozzle through the planar bottommost surface of the layer of core material.

20. The brush cleaning apparatus of claim 19 , wherein the nozzle is separated from the planar bottommost surface of the layer of core material along the line.