Patent Assignment
Reel/Frame 031785/0829
Security Agreement
Recorded: 2013-12-09
Pages: 10
Assignor
JABIL CIRCUIT, INC.
Executed: 2006-09-13
Assignee
CELETRONIX USA, INC
2125 N MADERA RD STE B, SIMI VALLEY, CALIFORNIA, 93065-7708
Covered Properties
(2)
Memory Module Assembly Using Partially Defective Chips
Patent:
6,119,049 →
Application:
08/909,489 →
Memory Module Assembly Using Partially Defective Chips
Patent:
39,016 →
Application:
10/242,536 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 18, 2000
From: BMI AQUISITION GROUP, INC.; SIGMA 7 CORPORATION; INTERCELL CORPORATION
To: TANDON ASSOCIATES, INC.
Reel/Frame 010565/0892 →
Assignment of Assignor's Interest
Jan 29, 2003
From: TANDON ASSOCIATES, INC.
To: CELETRON USA, INC.
Reel/Frame 013706/0824 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX USA, INC.
To: JABIL CIRCUIT, INC.
Reel/Frame 016345/0981 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX INTERNATIONAL, LTD.
To: JABIL CIRCUIT, INC.
Reel/Frame 016354/0022 →
Assignment of Assignor's Interest
Jun 21, 2011
From: TANDON GROUP, LTD
To: NICHOLS-IP PLLC
Reel/Frame 026472/0124 →