Patent Assignment
Reel/Frame 026472/0124
Assignment of Assignor's Interest
Recorded: 2011-06-21
Pages: 2
Assignor
TANDON GROUP, LTD
Executed: 2011-06-20
Assignee
NICHOLS-IP PLLC
740 E. 250 N., HEBER, UTAH, 84032
Covered Properties
(3)
Memory Module Assembly Using Partially Defective Chips
Patent:
6,119,049 →
Application:
08/909,489 →
Memory Module Assembly Using Partially Defective Chips
Patent:
39,016 →
Application:
10/242,536 →
Methods and Apparatus for Fabricating Chip-on-Board Modules
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 18, 2000
From: BMI AQUISITION GROUP, INC.; SIGMA 7 CORPORATION; INTERCELL CORPORATION
To: TANDON ASSOCIATES, INC.
Reel/Frame 010565/0892 →
Assignment of Assignor's Interest
Jan 29, 2003
From: TANDON ASSOCIATES, INC.
To: CELETRON USA, INC.
Reel/Frame 013706/0824 →
Assignment of Assignor's Interest
Feb 20, 2003
From: PEDDLE, CHARLES I.
To: CELETRON INTERNATIONAL, LTD.
Reel/Frame 013802/0077 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX USA, INC.
To: JABIL CIRCUIT, INC.
Reel/Frame 016345/0981 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX INTERNATIONAL, LTD.
To: JABIL CIRCUIT, INC.
Reel/Frame 016354/0022 →
Security Agreement
Dec 9, 2013
From: JABIL CIRCUIT, INC.
To: CELETRONIX USA, INC
Reel/Frame 031785/0829 →
Release of Patent Collateral Assignment and Security Interest
Mar 19, 2014
From: JABIL CIRCUIT, INC.
To: CELETRONIX USA, INC.
Reel/Frame 032479/0786 →
Assignment of Assignor's Interest
Oct 22, 2022
From: CELETRON INTERNATIONAL, LTD; CELETRONIX USA INC; TANDON GROUP LTD
To: NICHOLS-IP PLLC
Reel/Frame 061504/0592 →
Assignment of Assignor's Interest
May 30, 2024
From: NICHOLS-IP PLLC
To: HELIX MICRO INNOVATIONS LLC
Reel/Frame 067562/0349 →