IP Library Assignment 061504/0592
Patent Assignment
Reel/Frame 061504/0592

Assignment of Assignor's Interest

Recorded: 2022-10-22 Pages: 5
Assignors
CELETRON INTERNATIONAL, LTD
Executed: 2011-06-20
CELETRONIX USA INC
Executed: 2011-06-20
TANDON GROUP LTD
Executed: 2011-06-20
Assignee
NICHOLS-IP PLLC
803 E DUTCH VALLEY DR,, MIDWAY, UTAH, 84049
Covered Property (1)
Methods and Apparatus for Fabricating Chip-on-Board Modules
Patent: 7,238,550 →
Application: 10/371,800 →
Publication: US 2003/0159278
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 20, 2003
From: PEDDLE, CHARLES I.
To: CELETRON INTERNATIONAL, LTD.
Reel/Frame 013802/0077 →
Patent Collateral Assignment and Security Interest Aug 4, 2005
From: CELETRONIX USA, INC.
To: JABIL CIRCUIT, INC.
Reel/Frame 016345/0981 →
Patent Collateral Assignment and Security Interest Aug 4, 2005
From: CELETRONIX INTERNATIONAL, LTD.
To: JABIL CIRCUIT, INC.
Reel/Frame 016354/0022 →
Assignment of Assignor's Interest Jun 21, 2011
From: TANDON GROUP, LTD
To: NICHOLS-IP PLLC
Reel/Frame 026472/0124 →
Release of Patent Collateral Assignment and Security Interest Mar 19, 2014
From: JABIL CIRCUIT, INC.
To: CELETRONIX USA, INC.
Reel/Frame 032479/0786 →
Assignment of Assignor's Interest May 30, 2024
From: NICHOLS-IP PLLC
To: HELIX MICRO INNOVATIONS LLC
Reel/Frame 067562/0349 →