IP Library Assignment 013802/0077
Patent Assignment
Reel/Frame 013802/0077

Assignment of Assignor's Interest

Recorded: 2003-02-20 Pages: 2
Assignor
PEDDLE, CHARLES I.
Executed: 2003-02-18
Assignee
CELETRON INTERNATIONAL, LTD.
CLARENDON HOUSE, 2 CHURCH STREET - BOX HM 666, HAMILTON HM CX, BERMUDA
Covered Property (1)
Methods and Apparatus for Fabricating Chip-on-Board Modules
Patent: 7,238,550 →
Application: 10/371,800 →
Publication: US 2003/0159278
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Collateral Assignment and Security Interest Aug 4, 2005
From: CELETRONIX USA, INC.
To: JABIL CIRCUIT, INC.
Reel/Frame 016345/0981 →
Patent Collateral Assignment and Security Interest Aug 4, 2005
From: CELETRONIX INTERNATIONAL, LTD.
To: JABIL CIRCUIT, INC.
Reel/Frame 016354/0022 →
Assignment of Assignor's Interest Jun 21, 2011
From: TANDON GROUP, LTD
To: NICHOLS-IP PLLC
Reel/Frame 026472/0124 →
Release of Patent Collateral Assignment and Security Interest Mar 19, 2014
From: JABIL CIRCUIT, INC.
To: CELETRONIX USA, INC.
Reel/Frame 032479/0786 →
Assignment of Assignor's Interest Oct 22, 2022
From: CELETRON INTERNATIONAL, LTD; CELETRONIX USA INC; TANDON GROUP LTD
To: NICHOLS-IP PLLC
Reel/Frame 061504/0592 →
Assignment of Assignor's Interest May 30, 2024
From: NICHOLS-IP PLLC
To: HELIX MICRO INNOVATIONS LLC
Reel/Frame 067562/0349 →