Patent Assignment
Reel/Frame 032479/0786
Release of Patent Collateral Assignment and Security Interest
Recorded: 2014-03-19
Pages: 2
Assignor
JABIL CIRCUIT, INC.
Executed: 2014-03-05
Assignee
CELETRONIX USA, INC.
2125-B MADERA ROAD, SIMI VALLEY, CALIFORNIA, 93065
Covered Property
(1)
Methods and Apparatus for Fabricating Chip-on-Board Modules
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 20, 2003
From: PEDDLE, CHARLES I.
To: CELETRON INTERNATIONAL, LTD.
Reel/Frame 013802/0077 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX USA, INC.
To: JABIL CIRCUIT, INC.
Reel/Frame 016345/0981 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX INTERNATIONAL, LTD.
To: JABIL CIRCUIT, INC.
Reel/Frame 016354/0022 →
Assignment of Assignor's Interest
Jun 21, 2011
From: TANDON GROUP, LTD
To: NICHOLS-IP PLLC
Reel/Frame 026472/0124 →
Assignment of Assignor's Interest
Oct 22, 2022
From: CELETRON INTERNATIONAL, LTD; CELETRONIX USA INC; TANDON GROUP LTD
To: NICHOLS-IP PLLC
Reel/Frame 061504/0592 →
Assignment of Assignor's Interest
May 30, 2024
From: NICHOLS-IP PLLC
To: HELIX MICRO INNOVATIONS LLC
Reel/Frame 067562/0349 →