Patent Assignment
Reel/Frame 067562/0349
Assignment of Assignor's Interest
Recorded: 2024-05-30
Pages: 6
Assignor
NICHOLS-IP PLLC
Executed: 2023-09-21
Assignee
HELIX MICRO INNOVATIONS LLC
261 WEST 35TH ST, SUITE 1003, NEW YORK, NEW YORK, 10001
Covered Properties
(3)
Patching Methods and Apparatus for Fabricating Memory Modules
Method and apparatus for implementing a selectively operable clock booster for DDR memory or other logic modules which utilize partially-defective memory parts, or a combination of partially-defective and flawless memory parts
Application:
10/371,736 →
Publication:
US 2003/0161198
Methods and Apparatus for Fabricating Chip-on-Board Modules
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 20, 2003
From: PEDDLE, CHARLES I.
To: CELETRON INTERNATIONAL, LTD.
Reel/Frame 013802/0077 →
Assignment of Assignor's Interest
Feb 20, 2003
From: PEDDLE, CHARLES I.
To: CELETRON INTERNATIONAL, LTD.
Reel/Frame 015864/0466 →
Assignment of Assignor's Interest
Feb 20, 2003
From: PEDDLE, CHARLES I.
To: CELETRON INTERNATIONAL, LTD.
Reel/Frame 015865/0190 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX INTERNATIONAL, LTD.
To: JABIL CIRCUIT, INC.
Reel/Frame 016354/0022 →
Patent Collateral Assignment and Security Interest
Aug 4, 2005
From: CELETRONIX USA, INC.
To: JABIL CIRCUIT, INC.
Reel/Frame 016345/0981 →
Assignment of Assignor's Interest
Jun 21, 2011
From: TANDON GROUP, LTD
To: NICHOLS-IP PLLC
Reel/Frame 026472/0124 →
Release of Patent Collateral Assignment and Security Interest
Mar 19, 2014
From: JABIL CIRCUIT, INC.
To: CELETRONIX USA, INC.
Reel/Frame 032479/0786 →
Assignment of Assignor's Interest
Oct 22, 2022
From: CELETRON INTERNATIONAL, LTD; CELETRONIX USA INC; TANDON GROUP LTD
To: NICHOLS-IP PLLC
Reel/Frame 061504/0592 →